Category |
Technical Specification |
Materials |
FR4, aluminum, teflon, copper bases & more
|
Surface Finish |
HASL, ENIG, OSP, Immersion Silver & Immersion Tin |
Layer Count |
Single-sided to 32 layers |
Trace/Space |
down to .003" |
Max. Panel size |
up to 21"x 26" |
Panel thickness |
up to .250" |
Copper Weight |
0.5- 4oz. inner / 1-20oz. outer |
Additional Capabilities |
Mixed dielectric (hybrid) constructions; Embedded coin, or metal core and metal backed MLB; Blind and buried vias, Via-in-pad, Plated Over Filled Vias (POFV); Customizable Serialization; Control-Depth Drilling (stub removal); Plasma Etchback; Castellated Vias; Edge Plating; Plated Slots/Countersink/Counterbores |