| Category | Details |
|---|---|
| Materials | Polyimide, FR4 |
| Layer Count | Up to 24 layers |
| Thickness | 0.2mm to 3.2mm |
| Copper Weight | 0.5 - 4 oz. inner / 1 - 20 oz. outer |
| Surface Finish | ENIG, OSP, Immersion Silver and more |
| Solder Mask | Flexible solder mask in various colors |
| Additional Capabilities | Heatsink application for thermal management; Loose leaf, bonded & Bookbinder flex constructions; ITAR and non-ITAR capabilities; Rigid-flex with High-Density Interconnect (HDI) technology |
