Standard Features | Standard | Advanced |
---|---|---|
Maximum Layer Count | 16 | 24 |
Maximum Panel Size | 18”x24” | 21”x26” |
Outer Layer Trace/Spacing | .005” / .005” | .003” / .003” |
Inner Layer Trace/Spacing | .005” / .005” | .003” / .003” |
Maximum PCB Thickness | 0.250” | 0.250” |
Minimum PCB Thickness | .008” | .004” |
Minimum Mechanical Drill Size | .008” | .004” |
Maximum PCB Aspect Ratio | 10:1 | 20:1 |
Maximum Copper Weight | 6oz | 16oz |
Minimum Copper Weight | 1/2oz | 1/4oz |
Minimum Core Thickness | 0.004” | 0.0015” |
Minimum Dielectric Thickness | 0.003” | 0.002” |
Minimum Pad Size Over Drill | 0.018” | 0.016” |
Solder Mask Registration | ± 0.002 | ± 0.0015 |
Minimum Solder Mask Dam | 0.004” | 0.0025” |
Copper Feature to PCB edge | 0.015” | 0.010” |
Tolerance on Overall Dimensions | ± 0.005” | ± 0.002” |
HDI Features | Standard | Advanced |
---|---|---|
Minimum Microvia Hole Size | 0.004” | 0.003” |
Capture Pad Size | 0.010” | 0.009” |
Glass Reinforced Dielectrics | Y | Y |
Maximum Aspect Ratio | 0.7:1 | 1:1 |
Stacked Microvias | Y | Y |
Copper Filled Microvias | Y | Y |
Buried Filled Vias | Y | Y |
Maximum No. of Buidup Layers | 3+N+3 | 5+N+5 |
PCB Technology | Standard | Advanced |
---|---|---|
Rigid-Flex & Flexible Circuits | Y | Y |
Buried and Blind Vias | Y | Y |
Sequential Lamination | Y | Y |
Impedance Control | ± 10% | ± 5% |
Hybrids & Mixed Dielectrics | Y | Y |
Aluminum Backed PCB | Y | Y |
Buried Capacitance | N | Y |
PCB with Cavity | N | Y |
Non-Conductive Via Fill (VIP) | Y | Y |
Conductive Hole Fill | Y | Y |
Depth Control Drill and Rout | Y | Y |
Backdrill | Y | Y |
Edge Plating | Y | Y |
Etch Back | Y | Y |
In-Board Beveling | Y | Y |
2-D Bar Code Printing | Y | Y |