Capability and Technologies

Standard Features Standard Advanced
Maximum Layer Count 16 24
Maximum Panel Size 18”x24” 21”x26”
Outer Layer Trace/Spacing .005” / .005” .003” / .003”
Inner Layer Trace/Spacing .005” / .005” .003” / .003”
Maximum PCB Thickness 0.250” 0.250”
Minimum PCB Thickness .008” .004”
Minimum Mechanical Drill Size .008” .004”
Maximum PCB Aspect Ratio 10:1 20:1
Maximum Copper Weight 6oz 16oz
Minimum Copper Weight 1/2oz 1/4oz
Minimum Core Thickness 0.004” 0.0015”
Minimum Dielectric Thickness 0.003” 0.002”
Minimum Pad Size Over Drill 0.018” 0.016”
Solder Mask Registration ± 0.002 ± 0.0015
Minimum Solder Mask Dam 0.004” 0.0025”
Copper Feature to PCB edge 0.015” 0.010”
Tolerance on Overall Dimensions ± 0.005” ± 0.002”
HDI Features Standard Advanced
Minimum Microvia Hole Size 0.004” 0.003”
Capture Pad Size 0.010” 0.009”
Glass Reinforced Dielectrics Y Y
Maximum Aspect Ratio 0.7:1 1:1
Stacked Microvias Y Y
Copper Filled Microvias Y Y
Buried Filled Vias Y Y
Maximum No. of Buidup Layers 3+N+3 5+N+5
PCB Technology Standard Advanced
Rigid-Flex & Flexible Circuits Y Y
Buried and Blind Vias Y Y
Sequential Lamination Y Y
Impedance Control ± 10% ± 5%
Hybrids & Mixed Dielectrics Y Y
Aluminum Backed PCB Y Y
Buried Capacitance N Y
PCB with Cavity N Y
Non-Conductive Via Fill (VIP) Y Y
Conductive Hole Fill Y Y
Depth Control Drill and Rout Y Y
Backdrill Y Y
Edge Plating Y Y
Etch Back Y Y
In-Board Beveling Y Y
2-D Bar Code Printing Y Y
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